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Electron beam assisted chemical vapor deposition of SiO2

dc.contributor.authorCollins, G. J., author
dc.contributor.authorBoyer, P. K., author
dc.contributor.authorEmery, K., author
dc.contributor.authorRocca, Jorge J., author
dc.contributor.authorThompson, L. R., author
dc.contributor.authorAmerican Institute of Physics, publisher
dc.date.accessioned2007-01-03T08:09:53Z
dc.date.available2007-01-03T08:09:53Z
dc.date.issued1983
dc.description.abstractWe have demonstrated electron beam assisted chemical vapor deposition of silicon dioxide films on silicon substrates via electron impact dissociation of SiH4, and N2O gas. Dissociation of reactant gases occurs primarily in the confined planar region of the electron beam created plasma. Electron beam deposited SiO2 films have been categorized in terms of their electrical, physical, and chemical properties.
dc.format.mediumborn digital
dc.format.mediumarticles
dc.identifier.bibliographicCitationThompson, L. R., et al., Electron Beam Assisted Chemical Vapor Deposition of SiO2, Applied Physics Letters 43, no. 8 (October 15, 1983): 777-779.
dc.identifier.urihttp://hdl.handle.net/10217/67455
dc.languageEnglish
dc.language.isoeng
dc.publisherColorado State University. Libraries
dc.relation.ispartofFaculty Publications
dc.rights©1983 American Institute of Physics.
dc.rightsCopyright and other restrictions may apply. User is responsible for compliance with all applicable laws. For information about copyright law, please see https://libguides.colostate.edu/copyright.
dc.titleElectron beam assisted chemical vapor deposition of SiO2
dc.typeText

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