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Silicon nitride films deposited with an electron beam created plasma

dc.contributor.authorCollins, G. J., author
dc.contributor.authorZarnani, H., author
dc.contributor.authorThompson, L. R., author
dc.contributor.authorRocca, Jorge J., author
dc.contributor.authorEmery, K. A., author
dc.contributor.authorBishop, D. C., author
dc.contributor.authorAmerican Institute of Physics, publisher
dc.date.accessioned2007-01-03T08:09:53Z
dc.date.available2007-01-03T08:09:53Z
dc.date.issued1984
dc.description.abstractSilicon nitride films have been deposited using an electron beam created plasma in a silane, ammonia, and nitrogen mixture. The films were deposited at substrate temperatures between 50 and 400 °C. Physical, chemical, and electrical properties of these films are reported.
dc.format.mediumborn digital
dc.format.mediumarticles
dc.identifier.bibliographicCitationBishop, D. C., et al., Silicon Nitride Films Deposited with an Electron Beam Created Plasma, Applied Physics Letters 44, no. 6 (March 15, 1984): 598-600.
dc.identifier.urihttp://hdl.handle.net/10217/67451
dc.languageEnglish
dc.language.isoeng
dc.publisherColorado State University. Libraries
dc.relation.ispartofFaculty Publications
dc.rights©1984 American Institute of Physics.
dc.rightsCopyright and other restrictions may apply. User is responsible for compliance with all applicable laws. For information about copyright law, please see https://libguides.colostate.edu/copyright.
dc.titleSilicon nitride films deposited with an electron beam created plasma
dc.typeText

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