Large area radio frequency plasma for microelectronics processing
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Radio-frequency (rf) inductively coupled planar plasma (ICP) provides a better way to generate spatially confined high density gas discharge plasmas for microelectronics processing. Commercial processing equipment using this technique is currently available, but is limited in size to 20 cm in diameter by problems with plasma uniformity and antenna dielectric window erosion. We have developed a new planar ICP antenna and dielectric window design that allows for larger dimensions (up to 50 cm in diameter) with good uniformity. The current art ICP antenna requires a thick quartz (or ceramic) plate ...