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Silicon nitride films deposited with an electron beam created plasma

Date

1984

Authors

Collins, G. J., author
Zarnani, H., author
Thompson, L. R., author
Rocca, Jorge J., author
Emery, K. A., author
Bishop, D. C., author
American Institute of Physics, publisher

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Abstract

Silicon nitride films have been deposited using an electron beam created plasma in a silane, ammonia, and nitrogen mixture. The films were deposited at substrate temperatures between 50 and 400 °C. Physical, chemical, and electrical properties of these films are reported.

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